FX23-100P-0.5SV15: Premium High-Density Surface Mount Header Connector by Hirose Electric

The FX23-100P-0.5SV15 is a cutting-edge surface mount header connector engineered by Hirose Electric Co Ltd, a global leader in interconnect solutions. Designed for high-density applications, this connector delivers exceptional performance, reliability, and versatility. In this comprehensive guide, we explore its specifications, benefits, and applications to help you make an informed decision for your next project.

Product Overview

The FX23-100P-0.5SV15 belongs to the Rectangular Connector - Arrays, Edge Type, Mezzanine (Board to Board) category. It is an active product, ensuring compliance with the latest industry standards. This connector is widely used in applications requiring compact, high-performance interconnects.

Key Features and Specifications

1. Connector Type

• Header, Outer Shroud Contacts: Provides secure mating and superior electrical performance. The outer shroud design enhances mechanical stability and protects against environmental factors.

2. Number of Positions

• 104 (100 Signal + 4 Power): The inclusion of dedicated power positions ensures efficient power delivery alongside signal transmission, making it ideal for complex electronic systems.

3. Pitch

• 0.020" (0.50mm): The ultra-fine pitch allows for high-density PCB designs, saving valuable space in compact devices like smartphones, wearables, and IoT modules.

4. Number of Rows

• 2: Dual-row configuration ensures balanced signal distribution and robust mechanical strength.

5. Mounting Type

• Surface Mount (SMT): Compatible with automated assembly processes, reducing manufacturing time and costs while improving precision.

6. Features

• Board Guide: Integrated alignment guides simplify PCB assembly, minimizing errors and enhancing reliability.
• High-Temperature Resistance: Suitable for applications exposed to elevated temperatures.

7. Contact Finish

• Gold Plating: Offers excellent conductivity, low contact resistance, and corrosion resistance, ensuring long-term reliability.

8. Contact Finish Thickness

• 4.00 in (0.100 m): Optimized thickness for durability and consistent electrical performance.

9. Mated Stacking Heights

• 15mm, 20mm: Flexible stacking options accommodate various PCB layer configurations.

10. Height Above Board

• 0.507" (12.88mm): Low-profile design ideal for space-constrained applications.

Why Choose the FX23-100P-0.5SV15?

1. Superior Reliability: Gold-plated contacts and robust construction ensure stable performance in harsh environments.
2. Space-Saving Design: 0.5mm pitch and compact form factor enable high-density PCB layouts.
3. Ease of Integration: SMT compatibility and board guides streamline production processes.
4. Versatility: Supports multiple stacking heights and mixed signal/power applications.

Applications

The FX23-100P-0.5SV15 is widely used in: - Consumer Electronics: Smartphones, tablets, wearables. - Telecommunications: Routers, base stations. - Industrial Automation: Control systems, robotics. - Medical Devices: Diagnostic equipment, portable monitors. - Automotive Systems: Infotainment, ADAS modules.

Technical Support and Resources

Hirose Electric provides comprehensive support, including: - Detailed datasheets and CAD models. - Customization options for specific requirements. - Global technical assistance for integration challenges.

Conclusion

The FX23-100P-0.5SV15 is a top-tier solution for high-density interconnect challenges. Its combination of fine pitch, gold-plated contacts, and flexible stacking options makes it indispensable for modern electronics. By choosing this connector, you ensure reliability, efficiency, and scalability for your designs.

Ready to upgrade your connectivity solution? Purchase the FX23-100P-0.5SV15 today and leverage Hirose Electric's expertise for your next breakthrough project!