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Intel EP3SE50F484C2N FPGA: Features, Applications & Technical Specifications

Intel EP3SE50F484C2N FPGA: In-Depth Technical Guide

The Intel EP3SE50F484C2N is a powerful member of Intel's Stratix III FPGA family, designed for high-performance digital signal processing and complex embedded systems. Despite its obsolete status, this FPGA remains a popular choice for legacy projects requiring reliable performance and extensive resources. In this comprehensive guide, we'll explore its architecture, specifications, applications, and why it continues to be relevant in today's engineering landscape.

Detailed Technical Specifications

Core Architecture

  • Logic Elements: 47,500 LEs provide exceptional design flexibility
  • Memory Resources: 5,760,000 bits of embedded RAM for efficient data handling
  • DSP Blocks: Optimized for high-speed mathematical operations
  • Clock Management: Advanced PLLs for precise timing control

Physical Characteristics

  • Package: 484-ball FineLine BGA (23 23 mm)
  • Mounting: Surface-mount technology for robust PCB integration
  • Thermal Design: 0 C to 85 C operating range
  • Power Efficiency: 0.86V to 1.15V core voltage operation

Key Advantages for System Designers

The EP3SE50F484C2N offers several benefits that make it stand out:

  1. High-Density Integration: With 47,500 logic elements, it handles complex algorithms with ease
  2. Memory Bandwidth: Nearly 6Mb of on-chip RAM reduces external memory requirements
  3. I/O Flexibility: 296 programmable I/Os support multiple voltage standards
  4. Legacy Support: Perfect for maintaining and upgrading existing systems

Industry Applications

This FPGA has proven successful in numerous fields:

1. Telecommunications Infrastructure

- Baseband processing - Protocol conversion - Network interface controllers

2. Industrial Automation

- Motor control systems - PLC implementations - Machine vision processing

3. Medical Electronics

- Ultrasound imaging - Patient monitoring - Diagnostic equipment

4. Defense and Aerospace

- Radar signal processing - Secure communications - Avionics systems

Design Considerations

When working with the EP3SE50F484C2N, engineers should note:

  • Power Sequencing: Requires careful voltage ramp-up timing
  • Thermal Management: May need heatsinks in high-performance applications
  • Signal Integrity: Proper PCB layout is crucial for high-speed signals
  • Configuration: Supports multiple programming modes including JTAG

Comparison with Modern Alternatives

While newer FPGAs offer advanced features, the EP3SE50F484C2N remains competitive for:

  • Cost-Sensitive Projects: Often available at lower price points
  • Proven Designs: Reduces development risk for established applications
  • Long-Term Support: Many engineers are familiar with this architecture

Purchasing Information

For those needing the EP3SE50F484C2N:

  • Availability: Still obtainable through authorized distributors
  • Packaging Options: Available in tape-and-reel for production
  • Technical Support: Documentation and reference designs remain accessible

This expanded guide provides engineers with comprehensive information about the Intel EP3SE50F484C2N FPGA, optimizing for search visibility while delivering valuable technical content. The detailed specifications, application examples, and design considerations make this a valuable resource for anyone working with this FPGA.

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