TE Connectivity AMP Connectors 3-1827233-6: High-Density SMD Plug Connector for Demanding Applications

The TE Connectivity AMP Connectors 3-1827233-6 represents the pinnacle of high-density interconnect solutions, offering unmatched reliability for mission-critical board-to-board applications. This comprehensive guide explores every aspect of this advanced connector, helping engineers and procurement specialists make informed decisions for their next-generation designs.

Product Overview and Market Position

As part of TE Connectivity's premium Active Product Status lineup, the 3-1827233-6 sets new standards in the Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) category. With increasing demand for miniaturized yet high-performance interconnects across industries, this 440-position solution addresses critical design challenges in:

• 5G telecommunications infrastructure
• Industrial IoT devices
• Advanced medical imaging systems
• High-performance computing
• Automotive electronics

Detailed Technical Specifications

Advanced Contact System

The connector features a dual-row, 440-position configuration with 0.50mm pitch spacing, achieving industry-leading density without compromising reliability. The gold-plated contacts (8.00 in/0.203 m thickness) ensure:

• Contact resistance: <1m initial
• Durability: 500+ mating cycles
• Operating temperature: -55 C to +125 C

Mechanical Design Features

The innovative design incorporates multiple reliability-enhancing elements:

Feature	Benefit
Precision-molded board guides	0.05mm alignment accuracy
Integrated ground plate	Reduces EMI by 40% vs standard designs
Reinforced outer shroud	Withstands 50N mating force
Low-profile design (4.45mm)	Saves 30% space versus competitors

Performance Comparison

When benchmarked against similar connectors in its class, the 3-1827233-6 demonstrates superior characteristics:

• Signal Integrity: Maintains 10Gbps data rates with <1% BER
• Environmental Resistance: Passes 500hr salt spray testing
• Thermal Performance: 1.5A current rating per contact at 85 C
• Mechanical Stability: Withstands 50G shock and 5G vibration

Application-Specific Implementation

5G Base Station Solutions

In mmWave antenna arrays, the connector's 5mm and 8mm stacking height options enable flexible RF front-end designs while maintaining signal integrity across 64-antenna MIMO configurations.

Automotive ADAS Systems

The vibration-resistant design meets ISO 16750-3 standards, making it ideal for camera modules and radar processing units in autonomous vehicles.

Design Guidelines

For optimal performance, TE Connectivity recommends:

1. PCB pad design: 0.25mm x 0.65mm with 0.5mm spacing
2. Reflow profile: Peak temp 260 C for 10sec max
3. Cleaning: Use no-clean flux to prevent gold leaching
4. Handling: Vacuum pickup recommended for SMT placement

Frequently Asked Questions

Q: What's the difference between 3-1827233-6 and 3-1827233-7?
A: The -7 variant features a higher 10 in gold plating for extended durability in harsh environments.

Q: Can this connector be used for power applications?
A: While primarily designed for signal transmission, parallel contacts can deliver up to 3A when properly configured.

Why Engineers Choose 3-1827233-6

Leading OEMs consistently select this connector for:

• 28% reduction in PCB area versus 0.8mm pitch alternatives
• TE's global supply chain assurance (12-week lead time typical)
• Full documentation including 3D models and IBIS files
• Compliance with RoHS 3.0 and REACH regulations

Conclusion

The TE Connectivity AMP Connectors 3-1827233-6 delivers an unparalleled combination of density, reliability, and performance for today's most challenging interconnect applications. With its advanced features and proven track record in demanding environments, it represents the smart choice for engineers pushing the boundaries of electronic design.

Ready to integrate 3-1827233-6 into your design? Contact our technical team today for samples, pricing, and application support to accelerate your development timeline.