TLV2372IDR: High-Performance Dual-Channel Op-Amp | Rail-to-Rail Output
TLV2372IDR: Texas Instruments' Precision Dual-Channel Operational Amplifier
The TLV2372IDR by Texas Instruments represents the gold standard in general-purpose operational amplifiers, combining precision performance with energy efficiency in a compact SOIC-8 package. This in-depth technical analysis explores why engineers worldwide trust this IC for critical analog designs across industries.
Detailed Product Specifications
Electrical Characteristics
- Architecture: CMOS input stage with rail-to-rail output
- GBW: 3MHz (typical) ensures stable gain at audio frequencies
- Slew Rate: 2.1V/ s enables crisp signal reproduction
- Input Offset Voltage: 2mV max (25 C) for precision applications
- Input Bias Current: 1pA (typical) among lowest in class
- CMRR: 76dB (typical) rejects common-mode interference
- PSRR: 90dB minimizes power supply noise effects
Power Management
Parameter | Value |
---|---|
Supply Range | 2.7V to 16V (single or dual supply) |
Quiescent Current | 750 A/channel (typical at 5V) |
Shutdown Current | 0.5 A (when enabled) |
Output Current | 16mA (continuous) |
Advanced Features Breakdown
Rail-to-Rail Output Stage
The TLV2372IDR's output swings within 50mV of both supply rails (at 10k load), maximizing dynamic range in low-voltage systems. This makes it ideal for:
- Battery-powered equipment (3V systems)
- ADC/DAC interface circuits
- Portable measurement devices
EMI Hardened Design
Specialized internal architecture provides:
- RFI suppression up to 1GHz
- Reduced sensitivity to mobile phone interference
- Stable operation in electrically noisy environments
Application-Specific Implementations
Industrial Sensor Interfaces
Case Study: 4-20mA current loop transmitter
- Utilizes both channels for signal conditioning
- First stage: Instrumentation amplifier configuration
- Second stage: Voltage-to-current conversion
- Maintains <0.1% linearity error across temperature
Automotive Designs
Implementation examples:
- ECU signal conditioning circuits
- Battery management current sensing
- CAN bus analog front-end
- Meets AEC-Q100 Grade 2 requirements
Design Considerations
PCB Layout Guidelines
- Use ground plane under SOIC package
- Place decoupling capacitors within 5mm
- Route sensitive inputs away from digital traces
- Thermal vias recommended for high ambient temps
Thermal Performance
Thermal resistance metrics:
- JA: 160 C/W (still air)
- JC: 45 C/W (effective with thermal vias)
- Max power dissipation: 710mW at 70 C
Comparative Analysis
vs. Competing Devices
Parameter | TLV2372IDR | LM358 | MCP6002 |
---|---|---|---|
Supply Range | 2.7-16V | 3-32V | 1.8-6V |
IQ (per ch) | 750 A | 500 A | 100 A |
GBW | 3MHz | 1MHz | 1MHz |
Cost | $$ | $ | $$ |
Purchasing Information
Available through authorized distributors:
- Package options: SOIC-8, TSSOP-8
- MOQ: 100 units (reel packaging)
- Lead time: 4-6 weeks (standard)
- RoHS & REACH compliant
Conclusion
The TLV2372IDR delivers exceptional value in the operational amplifier market, particularly for designs requiring:
- Precision signal chain solutions
- Mixed-voltage system compatibility
- Space-constrained PCB layouts
- Harsh environment operation
For engineers developing next-generation industrial, automotive, or IoT devices, this op-amp provides the perfect balance of performance, power efficiency, and cost-effectiveness. Its combination of rail-to-rail output, wide voltage range, and Texas Instruments' quality assurance makes it a preferred choice for mission-critical analog designs.