XC7Z035-3FFG900E: Advanced System-on-Chip (SoC) by AMD Xilinx

Comprehensive Overview

The XC7Z035-3FFG900E is a state-of-the-art System-on-Chip (SoC) developed by AMD Xilinx, designed to address the evolving needs of modern embedded systems. This highly integrated circuit combines the power of a dual-core ARM Cortex-A9 processor with the flexibility of Kintex-7 FPGA fabric, making it a versatile solution for applications requiring both high-performance computing and customizable logic. With its robust architecture, this SoC is engineered to deliver exceptional speed, efficiency, and adaptability for a wide range of industries.

In-Depth Technical Specifications

Manufacturer and Product Details

• Manufacturer: AMD Xilinx (formerly Xilinx, now part of Advanced Micro Devices)
• Part Number: XC7Z035-3FFG900E
• Product Category: Integrated Circuits (ICs)
• Subcategory: Embedded - System On Chip (SoC)
• Product Status: Active and recommended for new designs

Processor Architecture

The XC7Z035-3FFG900E features a powerful hybrid architecture that combines:

• Processing System (PS): Dual ARM Cortex-A9 MPCore with CoreSight technology, operating at 800MHz
• Programmable Logic (PL): Kintex-7 FPGA fabric with 275K logic cells
• Cache Memory: 32KB instruction and data cache per core, plus 512KB L2 shared cache
• NEON SIMD co-processor and FPU for accelerated multimedia processing

Memory Configuration

• On-Chip Memory: 256KB RAM
• External Memory Support:
  • DDR3, DDR3L, DDR2, LPDDR2
  • NAND/NOR flash interfaces
  • Quad-SPI flash interface

Advanced Connectivity Options

The XC7Z035-3FFG900E provides comprehensive connectivity solutions:

• High-Speed Interfaces:
  • Gigabit Ethernet (10/100/1000)
  • USB 2.0 (OTG, host, device)
  • PCI Express Gen2 (x4 or x8)
• Standard Interfaces:
  • CAN 2.0B
  • I2C, SPI, UART
  • SD/SDIO/MMC
  • GPIO (54 dedicated)

FPGA Fabric Details

The integrated Kintex-7 FPGA fabric offers:

• 275,000 logic cells
• 16.3Mb block RAM
• 400 DSP slices
• 16 GTP transceivers (up to 6.6Gb/s)
• Clock management tiles with PLLs

Performance Characteristics

• Processing Performance: Up to 2,500 DMIPS per core (5,000 DMIPS total)
• FPGA Performance: 400MHz+ fabric speed
• Power Efficiency: Advanced 28nm HPL process technology
• Thermal Design: 0 C to +100 C junction temperature range

Package Information

• Package Type: 900-ball Flip-Chip Ball Grid Array (FCBGA)
• Package Dimensions: 31mm 31mm
• Pitch: 1mm ball pitch
• RoHS Compliance: Yes

Target Applications

The XC7Z035-3FFG900E is ideal for:

Industrial Applications

• Factory automation and control systems
• Motor control and robotics
• Industrial networking equipment
• Machine vision systems

Medical Applications

• Medical imaging (ultrasound, X-ray)
• Patient monitoring systems
• Diagnostic equipment

Communications Infrastructure

• Wireless base stations
• Software-defined radio
• Network processing

Automotive Systems

• Advanced driver assistance systems (ADAS)
• In-vehicle infotainment
• Vehicle-to-everything (V2X) communication

Aerospace and Defense

• Radar and sonar processing
• Secure communications
• Avionics systems

Development Ecosystem

AMD Xilinx provides comprehensive support for the XC7Z035-3FFG900E:

• Vivado Design Suite: Complete development environment
• SDK Tools: For ARM processor development
• IP Catalog: Extensive library of pre-verified IP cores
• Reference Designs: Accelerate time-to-market
• Evaluation Kits: Zynq-7000 SoC ZC706 Evaluation Kit

Competitive Advantages

The XC7Z035-3FFG900E offers several key benefits:

• System Integration: Combines processing and programmable logic in single device
• Flexibility: Adaptable to changing requirements through FPGA programmability
• Performance: High-speed processing with low latency
• Power Efficiency: Optimized for energy-sensitive applications
• Security Features: Secure boot, AES/SHA encryption, tamper detection

Design Considerations

When implementing the XC7Z035-3FFG900E:

• Power Management: Implement proper power sequencing
• Thermal Management: Consider heat dissipation requirements
• Signal Integrity: Careful PCB layout for high-speed signals
• Boot Configuration: Multiple boot options available

Conclusion

The XC7Z035-3FFG900E represents a powerful convergence of processing performance and programmable logic flexibility. With its dual ARM Cortex-A9 cores and substantial Kintex-7 FPGA resources, this SoC is well-suited for demanding applications across industrial, medical, communications, automotive, and aerospace sectors. The comprehensive feature set, combined with AMD Xilinx's robust development tools, makes the XC7Z035-3FFG900E an excellent choice for engineers developing next-generation embedded systems.

For developers looking to leverage the full potential of this advanced SoC, we recommend starting with AMD Xilinx's official documentation and evaluation kits. The combination of processing power, flexibility, and extensive peripheral support positions the XC7Z035-3FFG900E as a leading solution in its class.