2124-6313-9UA-1902
3M

3M
TEST BURN-IN PGA
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Upgrade your electronic projects with 2124-6313-9UA-1902 3M sockets, ideal for ICs and transistors. Featuring robust materials and precision engineering, these sockets offer excellent conductivity and long-term reliability. Suitable for applications in telecommunications, medical devices, and aerospace, they ensure seamless connectivity. Interested in learning more? Reach out to our team for personalized assistance!
Specifications
- Product Status: Obsolete
- Type: PGA, ZIF (ZIP)
- Number of Positions or Pins (Grid): 124 (13 x 13)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30.0µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES)
- Operating Temperature: -55°C ~ 150°C