2184-6325-9UA-1902
3M
3M
TEST BURN-IN PGA
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Trust 2184-6325-9UA-1902 3M sockets for your IC and transistor applications, delivering precision and durability. Featuring solderless installation, high pin counts, and resistance to environmental stressors, these sockets are versatile and dependable. Widely adopted in aerospace, marine, and energy sectors, they meet the highest industry standards. Contact us today to place your order or request additional specifications!
Specifications
- Product Status: Obsolete
- Type: PGA, ZIF (ZIP)
- Number of Positions or Pins (Grid): 184 (25 x 25)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30.0µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES)
- Operating Temperature: -55°C ~ 150°C
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