272-6325-9UA-1902
3M
3M
TEST BURN-IN PGA
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Choose 272-6325-9UA-1902 3M sockets for your IC and transistor needs, offering superior quality and reliability. Designed with features like gold-plated contacts and anti-vibration properties, these sockets excel in harsh environments. Frequently used in automotive electronics, IoT devices, and industrial controls, they ensure uninterrupted operation. Contact our sales team for expert advice and support!
Specifications
- Product Status: Obsolete
- Type: PGA, ZIF (ZIP)
- Number of Positions or Pins (Grid): 72 (25 x 25)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30.0µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES)
- Operating Temperature: -55°C ~ 150°C
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