BDN09-3CB/A01
CTS Thermal Management Products
CTS Thermal Management Products
HEATSINK CPU W/ADHESIVE .91"SQ
$2.87
Available to order
Reference Price (USD)
1+
$2.54000
10+
$2.47400
25+
$2.40680
50+
$2.27300
100+
$2.13930
250+
$2.00556
500+
$1.93870
1,000+
$1.73815
5,000+
$1.70473
Exquisite packaging
Discount
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Upgrade your thermal management with CTS Thermal Management Products's BDN09-3CB/A01 Heat Sinks, engineered for superior cooling efficiency. Featuring advanced fin designs and high-quality materials, these heat sinks ensure optimal thermal conductivity and longevity. Perfect for use in telecommunications, medical devices, and consumer electronics. Ready to enhance your system's performance? Submit your inquiry now and our team will assist you with the best thermal solutions.
Specifications
- Product Status: Active
- Type: Top Mount
- Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method: Thermal Tape, Adhesive (Included)
- Shape: Square, Pin Fins
- Length: 0.910" (23.11mm)
- Width: 0.910" (23.11mm)
- Diameter: -
- Fin Height: 0.355" (9.02mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 9.60°C/W @ 400 LFM
- Thermal Resistance @ Natural: 26.90°C/W
- Material: Aluminum
- Material Finish: Black Anodized
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