HSB11-252518
CUI Devices
CUI Devices
HEAT SINK, BGA, 25 X 25 X 18 MM
$1.28
Available to order
Reference Price (USD)
1+
$1.28000
500+
$1.2672
1000+
$1.2544
1500+
$1.2416
2000+
$1.2288
2500+
$1.216
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
CUI Devices's HSB11-252518 Heat Sinks offer cutting-edge thermal solutions for modern technology. With exceptional heat transfer capabilities and rugged durability, they are perfect for industrial machinery, defense systems, and consumer gadgets. Elevate your cooling strategy contact us now for personalized recommendations and competitive pricing.
Specifications
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA
- Attachment Method: Adhesive
- Shape: Square, Pin Fins
- Length: 0.984" (25.00mm)
- Width: 0.984" (25.00mm)
- Diameter: -
- Fin Height: 0.709" (18.00mm)
- Power Dissipation @ Temperature Rise: 5.5W @ 75°C
- Thermal Resistance @ Forced Air Flow: 4.50°C/W @ 200 LFM
- Thermal Resistance @ Natural: 13.70°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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