HSB27-434316
CUI Devices
CUI Devices
HEAT SINK, BGA, 43.1 X 43.1 X 16
$2.60
Available to order
Reference Price (USD)
1+
$2.60000
500+
$2.574
1000+
$2.548
1500+
$2.522
2000+
$2.496
2500+
$2.47
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
The HSB27-434316 Heat Sinks by CUI Devices set the standard in thermal management, delivering efficient and quiet operation. Designed with versatility in mind, these heat sinks are ideal for HVAC systems, audio amplifiers, and IoT devices. Need a dependable cooling partner? Send us your inquiry and let our experts guide you to the best thermal solution available.
Specifications
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA
- Attachment Method: Adhesive
- Shape: Square, Pin Fins
- Length: 1.697" (43.10mm)
- Width: 1.697" (43.10mm)
- Diameter: -
- Fin Height: 0.650" (16.51mm)
- Power Dissipation @ Temperature Rise: 8.98W @ 75°C
- Thermal Resistance @ Forced Air Flow: 2.80°C/W @ 200 LFM
- Thermal Resistance @ Natural: 8.35°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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