HSE-B18381-060H-W
CUI Devices
CUI Devices
HEAT SINK, EXTRUSION, TO-218, 38
$1.31
Available to order
Reference Price (USD)
1,800+
$0.89460
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Keep your systems cool and efficient with CUI Devices's HSE-B18381-060H-W Heat Sinks, built for high-performance applications. These heat sinks feature optimized thermal resistance and sleek designs, suitable for robotics, electric vehicles, and telecommunications. Ready to improve your thermal management? Submit your request today and benefit from our industry-leading expertise.
Specifications
- Product Status: Active
- Type: Board Level, Vertical
- Package Cooled: TO-218
- Attachment Method: Bolt On and PC Pin
- Shape: Rectangular, Angled Fins
- Length: 1.500" (38.10mm)
- Width: 1.638" (41.60mm)
- Diameter: -
- Fin Height: 0.984" (25.00mm)
- Power Dissipation @ Temperature Rise: 12.0W @ 75°C
- Thermal Resistance @ Forced Air Flow: 3.52°C/W @ 200 LFM
- Thermal Resistance @ Natural: 6.25°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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