HSE06-503045
CUI Devices
CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
$2.35
Available to order
Reference Price (USD)
1+
$2.35000
500+
$2.3265
1000+
$2.303
1500+
$2.2795
2000+
$2.256
2500+
$2.2325
Exquisite packaging
Discount
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Trust CUI Devices's HSE06-503045 Heat Sinks for superior thermal performance in any application. Featuring innovative designs and premium materials, these heat sinks are ideal for automotive, aerospace, and computing industries. Don t compromise on cooling efficiency get in touch with us now and explore our range of high-quality thermal solutions.
Specifications
- Product Status: Active
- Type: Board Level
- Package Cooled: TO-218, TO-220
- Attachment Method: Clip
- Shape: Rectangular, Fins
- Length: 1.969" (50.00mm)
- Width: 1.181" (30.00mm)
- Diameter: -
- Fin Height: 1.772" (45.00mm)
- Power Dissipation @ Temperature Rise: 12.79W @ 75°C
- Thermal Resistance @ Forced Air Flow: 2.10°C/W @ 200 LFM
- Thermal Resistance @ Natural: 5.86°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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