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HSS-B20-085H

CUI Devices
HSS-B20-085H Preview
CUI Devices
HEATSINK TO-220 3.4W ALUMINUM
$0.52
Available to order
Reference Price (USD)
5,000+
$0.36260
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram

Specifications

  • Product Status: Active
  • Type: Board Level
  • Package Cooled: TO-220
  • Attachment Method: PC Pin
  • Shape: Rectangular, Fins
  • Length: 0.303" (7.70mm)
  • Width: 0.775" (19.68mm)
  • Diameter: -
  • Fin Height: 0.790" (20.00mm)
  • Power Dissipation @ Temperature Rise: 3.4W @ 75°C
  • Thermal Resistance @ Forced Air Flow: 7.46°C/W @ 200 LFM
  • Thermal Resistance @ Natural: 22.06°C/W
  • Material: Aluminum
  • Material Finish: Black Anodized

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