TC1-200G
Chip Quik Inc.
Chip Quik Inc.
HEAT SINK COMPOUND - HIGH DENSIT
$49.95
Available to order
Reference Price (USD)
1+
$49.95000
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
TC1-200G thermal adhesives from Chip Quik Inc. provide robust and durable solutions for heat-sensitive applications. With excellent thermal conductivity and adhesion, they are ideal for automotive and telecommunications industries. Choose Chip Quik Inc. for innovative thermal management. Get in touch now to discuss your needs.
Specifications
- Product Status: Active
- Type: Silicone Compound
- Size / Dimension: 200 gram Jar
- Usable Temperature Range: -
- Color: White
- Thermal Conductivity: 0.67W/m-K
- Features: -
- Shelf Life: 60 Months
- Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Related Products
Wakefield-Vette
GL-60-10
Wakefield-Vette
BT-101-50M-EQZ
Wakefield-Vette
BT-301-50M-EQZ
Aavid, Thermal Division of Boyd Corporation
251G
Aavid, Thermal Division of Boyd Corporation
4952G
t-Global Technology
TG4040-D-30CC
t-Global Technology
S606P-30
Chip Quik Inc.
TC3-3.5G
Bergquist
2590999
t-Global Technology