TC1-20G
Chip Quik Inc.
Chip Quik Inc.
HEAT SINK COMPOUND - HIGH DENSIT
$12.95
Available to order
Reference Price (USD)
1+
$12.95000
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
TC1-20G thermal adhesives from Chip Quik Inc. provide robust and durable solutions for heat-sensitive applications. With excellent thermal conductivity and adhesion, they are ideal for automotive and telecommunications industries. Choose Chip Quik Inc. for innovative thermal management. Get in touch now to discuss your needs.
Specifications
- Product Status: Active
- Type: Silicone Compound
- Size / Dimension: 20 gram Syringe
- Usable Temperature Range: -
- Color: White
- Thermal Conductivity: 0.67W/m-K
- Features: -
- Shelf Life: 60 Months
- Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Related Products
ProhmTect
PROHMPROTECT-3800-1.5
NTE Electronics, Inc
NTE303A
t-Global Technology
TG-NSP80-30CC
t-Global Technology
TG-NSP35LV-4OZ
ProhmTect
PROHMPROTECT-3500-1.5
Jones Tech
21-420-001-010M
Chemtronics
CT40-5
t-Global Technology
S606C-30
Chip Quik Inc.
TC2-20G
Jones Tech