TE0803-03-3BE11-A
Trenz Electronic GmbH
Trenz Electronic GmbH
IC MODULE ZYNQ USCALE 2GB 128MB
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Enhance your electronic designs with TE0803-03-3BE11-A Trenz Electronic GmbH Embedded Modules, engineered for precision and reliability. These Microcontroller, Microprocessor, and FPGA Modules provide cutting-edge technology for applications in robotics, medical devices, and aerospace. Key features include high-speed processing, low latency, and customizable firmware, ensuring seamless performance in demanding environments. Trust TE0803-03-3BE11-A for your embedded solutions. Get in touch today to discuss your requirements and receive a customized offer.
Specifications
- Product Status: Obsolete
- Module/Board Type: MPU Core
- Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
- Co-Processor: -
- Speed: -
- Flash Size: 128MB
- RAM Size: 2GB
- Connector Type: B2B
- Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
- Operating Temperature: 0°C ~ 85°C
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