TH235-2-500G-JAR
Penchem Technologies Sdn Bhd
Penchem Technologies Sdn Bhd
NON SILICONE THERMAL PUTTY
$93.30
Available to order
Reference Price (USD)
1+
$93.30000
500+
$92.367
1000+
$91.434
1500+
$90.501
2000+
$89.568
2500+
$88.635
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Maximize heat dissipation with TH235-2-500G-JAR thermal pastes by Penchem Technologies Sdn Bhd, the preferred choice for professionals. These pastes ensure minimal thermal resistance and are perfect for overclocking and high-performance computing. Trust Penchem Technologies Sdn Bhd for reliable and efficient products. Send us your inquiry today for more information.
Specifications
- Product Status: Active
- Type: Non-Silicone Putty
- Size / Dimension: 500 gram Container
- Usable Temperature Range: 5°F ~ 248°F (-15°C ~ 200°C)
- Color: Blue
- Thermal Conductivity: 4.00W/m-K
- Features: -
- Shelf Life: 18 Months
- Storage/Refrigeration Temperature: -
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