TH994-288-192-2.0
Penchem Technologies Sdn Bhd

Penchem Technologies Sdn Bhd
SOFT SILICONE THERMAL PAD
$81.75
Available to order
Reference Price (USD)
1+
$81.75000
500+
$80.9325
1000+
$80.115
1500+
$79.2975
2000+
$78.48
2500+
$77.6625
Exquisite packaging
Discount
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Enhance your electronic systems with TH994-288-192-2.0 Thermal Pads and Sheets by Penchem Technologies Sdn Bhd, designed to meet the highest standards of thermal management. With excellent conformability and thermal transfer properties, these pads and sheets are ideal for applications in renewable energy systems, automotive controls, and more. Trust Penchem Technologies Sdn Bhd for reliable and efficient cooling solutions. Get in touch with us for more details and pricing.
Specifications
- Product Status: Active
- Usage: Thermally Conductive
- Type: Gap Filler Pad, Sheet
- Shape: Rectangular
- Outline: 288.00mm x 192.00mm
- Thickness: 0.0790" (2.000mm)
- Material: Silicone
- Adhesive: Tacky - Both Sides
- Backing, Carrier: -
- Color: Gray
- Thermal Resistivity: -
- Thermal Conductivity: 8.0W/m-K