TH997-288-192-1.5
Penchem Technologies Sdn Bhd
Penchem Technologies Sdn Bhd
SOFT SILICONE THERMAL PAD
$15.75
Available to order
Reference Price (USD)
1+
$15.75000
500+
$15.5925
1000+
$15.435
1500+
$15.2775
2000+
$15.12
2500+
$14.9625
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Penchem Technologies Sdn Bhd presents TH997-288-192-1.5 Thermal Pads and Sheets, the ultimate solution for effective heat dissipation in compact and high-performance devices. Featuring high thermal conductivity and electrical insulation, these products are widely used in consumer electronics, medical devices, and aerospace applications. Ensure your devices run cooler and last longer with our premium thermal management solutions. Request a sample or quote today!
Specifications
- Product Status: Active
- Usage: Thermally Conductive
- Type: Gap Filler Pad, Sheet
- Shape: Rectangular
- Outline: 288.00mm x 192.00mm
- Thickness: 0.0591" (1.500mm)
- Material: Silicone
- Adhesive: Tacky - Both Sides
- Backing, Carrier: -
- Color: Blue
- Thermal Resistivity: -
- Thermal Conductivity: 2.4W/m-K
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