TH997-288-192-2.0
Penchem Technologies Sdn Bhd
Penchem Technologies Sdn Bhd
SOFT SILICONE THERMAL PAD
$19.05
Available to order
Reference Price (USD)
1+
$19.05000
500+
$18.8595
1000+
$18.669
1500+
$18.4785
2000+
$18.288
2500+
$18.0975
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Choose TH997-288-192-2.0 Thermal Pads and Sheets from Penchem Technologies Sdn Bhd for superior heat dissipation in demanding environments. These products are crafted to provide long-lasting thermal stability, ensuring your equipment operates at peak efficiency. Commonly used in servers, power supplies, and telecommunications hardware, our thermal solutions are trusted by professionals globally. Reach out to us for a consultation or to request a sample.
Specifications
- Product Status: Active
- Usage: Thermally Conductive
- Type: Gap Filler Pad, Sheet
- Shape: Rectangular
- Outline: 288.00mm x 192.00mm
- Thickness: 0.0790" (2.000mm)
- Material: Silicone
- Adhesive: Tacky - Both Sides
- Backing, Carrier: -
- Color: Blue
- Thermal Resistivity: -
- Thermal Conductivity: 2.4W/m-K
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