TH997-288-192-3.0
Penchem Technologies Sdn Bhd
Penchem Technologies Sdn Bhd
SOFT SILICONE THERMAL PAD
$26.55
Available to order
Reference Price (USD)
1+
$26.55000
500+
$26.2845
1000+
$26.019
1500+
$25.7535
2000+
$25.488
2500+
$25.2225
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Maximize your device's thermal performance with TH997-288-192-3.0 Thermal Pads and Sheets from Penchem Technologies Sdn Bhd. These versatile products offer exceptional heat resistance and adaptability, making them suitable for CPUs, GPUs, and other heat-sensitive components. Whether for industrial or commercial use, our thermal pads and sheets deliver consistent results. Contact us now to discuss your specific requirements and place your order.
Specifications
- Product Status: Active
- Usage: Thermally Conductive
- Type: Gap Filler Pad, Sheet
- Shape: Rectangular
- Outline: 288.00mm x 192.00mm
- Thickness: 0.118" (3.00mm)
- Material: Silicone
- Adhesive: Tacky - Both Sides
- Backing, Carrier: -
- Color: Blue
- Thermal Resistivity: -
- Thermal Conductivity: 2.4W/m-K
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