XCVC1802-1LLIVSVD1760

AMD Xilinx

Manufacturer

AMD Xilinx

Description:

IC VERSAL AICORE FPGA 1760BGA

Datasheet:

XCVC1802-1LLIVSVD1760 Datasheet

$36,531.00

Available to order

Reference Price (USD)

$36531.00000

500+

$36165.69

1000+

$35800.38

1500+

$35435.07

2000+

$35069.76

2500+

$34704.45

Exquisite packaging

Discount

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The AMD Xilinx XCVC1802-1LLIVSVD1760 System on Chip redefines embedded processing with its innovative architecture and comprehensive feature set. This high-performance SoC combines multiple processing units with rich peripheral integration to address the most demanding embedded computing challenges. Featuring advanced security mechanisms, real-time performance, and support for multiple operating environments, the XCVC1802-1LLIVSVD1760 is equally suited for consumer electronics and industrial applications. Its thermal-efficient design enables fanless operation even in space-constrained environments. Backed by AMD Xilinx's global support network and long-term availability commitment, the XCVC1802-1LLIVSVD1760 provides a future-proof foundation for your embedded designs. Contact our sales team to discuss your project requirements and discover how this SoC can optimize your system architecture.

Specifications

Product Status: Active
Architecture: MPU, FPGA
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 400MHz, 1GHz
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BFBGA, FCBGA
Supplier Device Package: 1760-FCBGA (40x40)