XCVC1802-2MSEVSVD1760

AMD Xilinx

Manufacturer

AMD Xilinx

Description:

IC VERSAL AICORE FPGA 1760BGA

Datasheet:

XCVC1802-2MSEVSVD1760 Datasheet

$25,368.75

Available to order

Reference Price (USD)

$25368.75000

500+

$25115.0625

1000+

$24861.375

1500+

$24607.6875

2000+

$24354

2500+

$24100.3125

Exquisite packaging

Discount

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Discover the cutting-edge XCVC1802-2MSEVSVD1760 System on Chip (SoC) from AMD Xilinx, designed to power next-generation embedded applications. These highly integrated solutions combine processing power, memory, and peripherals in a single chip for maximum efficiency. Featuring advanced architecture with multi-core processing, low-power operation, and robust security features, our SoCs are ideal for IoT devices, industrial automation, and smart consumer electronics. The XCVC1802-2MSEVSVD1760 delivers exceptional performance with optimized power consumption, making it perfect for battery-operated and always-connected applications. With built-in connectivity options and extensive development support, this SoC simplifies your design process while future-proofing your products. Ready to integrate AMD Xilinx's XCVC1802-2MSEVSVD1760 into your project? Contact our technical team today for pricing, samples, and customization options.

Specifications

Product Status: Active
Architecture: MPU, FPGA
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.4GHz
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BFBGA, FCBGA
Supplier Device Package: 1760-FCBGA (40x40)