XCVM1802-2LSEVSVD1760

AMD Xilinx

Manufacturer

AMD Xilinx

Description:

IC VERSAL AICORE FPGA 1760BGA

Datasheet:

XCVM1802-2LSEVSVD1760 Datasheet

$13,084.74

Available to order

Reference Price (USD)

$13084.74000

500+

$12953.8926

1000+

$12823.0452

1500+

$12692.1978

2000+

$12561.3504

2500+

$12430.503

Exquisite packaging

Discount

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The XCVM1802-2LSEVSVD1760 System on Chip from AMD Xilinx represents the future of embedded computing, combining unparalleled integration with exceptional performance. This advanced SoC solution integrates CPU, GPU, DSP, and various peripherals to create complete systems on a single chip. Key features include high-speed interfaces, hardware acceleration blocks, and advanced power management suitable for demanding applications from robotics to 5G infrastructure. The XCVM1802-2LSEVSVD1760 reduces development time and system costs while providing the flexibility needed for custom implementations. AMD Xilinx's comprehensive software suite and reference designs ensure quick time-to-market for your innovative products. Interested in learning how the XCVM1802-2LSEVSVD1760 can transform your embedded projects? Submit your inquiry now for detailed specifications and volume pricing.

Specifications

Product Status: Active
Architecture: MPU, FPGA
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 450MHz, 1.08GHz
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BFBGA, FCBGA
Supplier Device Package: 1760-FCBGA (40x40)