XCZU3EG-L1UBVA530I

AMD Xilinx

Manufacturer

AMD Xilinx

Description:

IC ZUP MPSOC A53 FPGA LP 530BGA

Datasheet:

XCZU3EG-L1UBVA530I Datasheet

$610.08

Available to order

Reference Price (USD)

$610.08000

500+

$603.9792

1000+

$597.8784

1500+

$591.7776

2000+

$585.6768

2500+

$579.576

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

Discover the cutting-edge XCZU3EG-L1UBVA530I System on Chip (SoC) from AMD Xilinx, designed to power next-generation embedded applications. These highly integrated solutions combine processing power, memory, and peripherals in a single chip for maximum efficiency. Featuring advanced architecture with multi-core processing, low-power operation, and robust security features, our SoCs are ideal for IoT devices, industrial automation, and smart consumer electronics. The XCZU3EG-L1UBVA530I delivers exceptional performance with optimized power consumption, making it perfect for battery-operated and always-connected applications. With built-in connectivity options and extensive development support, this SoC simplifies your design process while future-proofing your products. Ready to integrate AMD Xilinx's XCZU3EG-L1UBVA530I into your project? Contact our technical team today for pricing, samples, and customization options.

Specifications

Product Status: Active
Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 600MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 530-WFBGA, FCBGA
Supplier Device Package: 530-FCBGA (16x9.5)