XCZU4EG-3FBVB900E

AMD Xilinx

Manufacturer

AMD Xilinx

Description:

IC SOC CORTEX-A53 900FCBGA

Datasheet:

XCZU4EG-3FBVB900E Datasheet

$2,661.72

Available to order

Reference Price (USD)

$2,217.69000

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

The XCZU4EG-3FBVB900E System on Chip from AMD Xilinx represents the future of embedded computing, combining unparalleled integration with exceptional performance. This advanced SoC solution integrates CPU, GPU, DSP, and various peripherals to create complete systems on a single chip. Key features include high-speed interfaces, hardware acceleration blocks, and advanced power management suitable for demanding applications from robotics to 5G infrastructure. The XCZU4EG-3FBVB900E reduces development time and system costs while providing the flexibility needed for custom implementations. AMD Xilinx's comprehensive software suite and reference designs ensure quick time-to-market for your innovative products. Interested in learning how the XCZU4EG-3FBVB900E can transform your embedded projects? Submit your inquiry now for detailed specifications and volume pricing.

Specifications

Product Status: Active
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)